CVE-2022-25657

{"cve": {"data_type": "CVE", "references": {"reference_data": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin", "name": "https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin", "tags": [], "refsource": "CONFIRM"}]}, "data_format": "MITRE", "description": {"description_data": [{"lang": "en", "value": "Memory corruption due to buffer overflow occurs while processing invalid MKV clip which has invalid seek header in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables"}]}, "problemtype": {"problemtype_data": [{"description": []}]}, "data_version": "4.0", "CVE_data_meta": {"ID": "CVE-2022-25657", "ASSIGNER": "security.cna@qualcomm.com"}}, "impact": {}, "publishedDate": "2022-09-02T12:15Z", "configurations": {"nodes": [], "CVE_data_version": "4.0"}, "lastModifiedDate": "2022-09-02T12:56Z"}